SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

Electronic Design’s readers have spoken. We present the top analog articles of 2024, as well as invite you, our readers, to ...

Advances in materials science stemming from research in South Korea are leading to higher-performance piezoelectric and ...

Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...

The AMD unified shader architecture that debuted in the Xbox 360 ushered in a new era for the graphics processing unit (GPU).

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

Inside the latest 16-phase power controller from Alpha and Omega Semiconductor and how it helps feed power-hungry GPUs and ...

CHIPS Act spurred a renaissance moment in the semiconductor industry, threatening to be upended by a significant skills gap.

An eFPGA is an FPGA that’s embedded into an ASIC to provide one or more programmable-logic fabrics for flexibility and ...

Vehicle-to-everything (V2X) technology transforms automotive connectivity and safety, but it requires robust storage ...

The ultra-low-power NuRAM/SmartMem compute-in-memory technology implements MRAM to overcome memory bottlenecks.

Additive manufactured electronics is grabbing the attention of the electronics industry. Nano Dimension’s Zvika Avlon ...